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Synamic8GN
特點(diǎn)
● 低Dk/Df (10GHz): 3.28/0.0019
● 高Tg 200℃ (DMA)
● 更優(yōu)異的熱可靠性
● 更優(yōu)異的耐離子遷移性能
● 更低的Z軸熱膨脹系數，優(yōu)異的通孔可靠性應用領(lǐng)域
● 超高速網(wǎng)絡(luò )設備
● 服務(wù)器、交換機、存儲、路由器等
● 高性能計算機
● 高頻測量?jì)x器等
● 光通信產(chǎn)品
- 產(chǎn)品性能
- 產(chǎn)品證書(shū)
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 200 |
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 430 |
|
T288 |
2.4.24.1 | TMA | min | >120 |
| T300 |
2.4.24.1 |
TMA |
min |
>120 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 45 |
| After Tg | ppm/℃ | 230 | ||
| 50-260℃ | % | 2.2 | ||
|
Dissipation Constant |
2.5.5.9 (1GHz) |
C-24/23/50 |
- |
3.35 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 3.28 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 3.49 | |
|
Dissipation Factor |
2.5.5.9 (1GHz) |
C-24/23/50 |
- | 0.0008 |
|
2.5.5.5 (10GHz) |
C-24/23/50 |
- | 0.0019 | |
|
SPDR (10GHz) |
C-24/23/50 |
- | 0.0021 | |
| Peel Strength (1Oz, RTF2/HVLP2) | 2.4.8 | 288℃/10s | N/mm [lb/in] | 0.82/0.80 [4.7/4.6] |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.10 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
Remarks:
1. Allthe typical value is based on the 30mil (6*2116) thickness specimen, but not guaranteedata.
2. All the typicalvalue listed above is for your reference only, please turn to ShengyiTechnology Co., Ltd. for detailed information, and all rights from this datasheet are reserved by Shengyi Technology Co., Ltd.